AIM’s Liquid Fluxes and Paste Fluxes
FX16 No Clean Liquid Flux
- Halide/Halogen-Free - ROL0 Per IPC J-STD-004A/B - Low Post Process Residues - Fast Wetting with All Leaded and Lead-Free Alloys - IPC-A-610F Compliant - High SIR Performance
FX16 No Clean Flux has been engineered to provide exceptional soldering performance while leaving minimal, electrically safe flux residues, even when unheated. FX16 is ideally formulated for point-to-point selective soldering and palletized wave soldering. FX16 provides fast wetting and PTH barrel fill and reduces common soldering defects such as bridging, flagging and solder balls. FX16 has a durable activation system that can withstand high process temperature required for thermally demanding applications and extended solder contact time.
NC280 Liquid Rework Flux
- Passes SIR in Raw State - Low-Residue - Extremely Safe for Rework - Halide-Free - Wide Process Window - Can Be Foamed, Sprayed, Misted, or Dipped
NC280 is a low-to-medium solids, no-clean liquid flux formulated to leave minimal post-process residues that are pin testable without cleaning. NC280 offers an excellent activity level with good performance on bare copper, solder coated and organic coated PWBs, leaving negligible post-process residues that are non-conductive and do not require post-process cleaning. NC280 is safe to be left on the circuit board and passes SIR in the raw state. NC280 is extremely safe for rework, palletized wave soldering and point-to-point selective soldering. NC280 has a unique chemistry and a wide process window, making it a drop-in for most no-clean and RMA wave soldering operations, including lead-free wave soldering.
NC217 Lead-Free & Tin-Lead Gel Flux
Features: - Tin-Lead and Lead-Free Compatible - Dries Without Heat - Passes SIR in Raw State
NC217 Gel Flux is designed for touch-up and repair work where the flux may spread away from the heat source. NC217 Gel Flux is electrically safe even without a thermal profile. This gel flux dries within one hour of use with or without heat and is tack-free after four hours.
Features: - Rosin Activated - Non-Corrosive Residues - Improved Soldering Performance - Residues Removable With a Saponifier - Can Be Foamed, Sprayed, Dipped or Brushed
RMA 202-25 is a medium solids, mildly activated liquid flux with a solvent rosin activation formulated to provide a post-process flux residue that is both insulating and non-hydroscopic and does not require cleaning. As a mildly activated rosin based flux, RMA 202-25 offers a wide process window, good cleaning properties, and excellent thermal transfer.
WS715M Liquid Flux
Features: - Neutral PH Flux - Lead-Free and Tin-Lead Compatible - Excellent Wetting - Wide Process Window - Can Be Foamed, Sprayed, Brushed or Dipped - Passes IPC Requirements
WS715M is a neutral alcohol based, organically activated, rosin-free, water soluble liquid flux designed specifically for wave solder applications. Though designed for application via foam fluxer, WS715M may also be applied by automated flux sprayers, dipped, or brushed on with favorable results. WS715M is a buffered flux that has a wide activation range and good wetting characteristics that produce bright shiny solder joints. WS715M performs well with bare copper, solder coated, and organic coated pwbs. Since WS715M flux is still active post-process, all residues must be removed from pwbs.
WS716 Liquid Flux
Features: - Halide-Free - Rosin-Free - Phosphate-Free - Same Chemistry as WS477S1 Paste - Can Be Foamed, Sprayed, Brushed, or Dipped - Excellent Wetting WS716 is a halogen- and halide-free, alcohol based, organically activated, rosin-free, water soluble liquid flux designed specifically for wave solder applications. WS716 is the liquid version of the WS-477S1 series solder paste. Though designed for application via foam fluxer, WS716 may also be applied by automated flux sprayers, dipped, or brushed on with favorable results. WS716 is a buffered flux with a wide activation range and exceptional wetting characteristics that produce bright shiny solder joints. WS716 performs well with bare copper, solder coated, and organic coated pwbs. Since WS716 flux is still active post-processing, all residues must be removed after soldering.
WS770 Liquid Flux
Features: - High Activity Level - Improved Cleaning - Can Be Foamed, Sprayed, Brushed or Dipped - Excellent Wetting - Wide Process Window - Foam Resistant Residues
WS770 is a PH neutral, organically activated, water-based, VOC-free water-soluble liquid flux formulated to fully atomize during the wave soldering process. WS770 may be applied by automated flux sprayers, foamed, dipped, or brushed on with favorable results. WS770 is a buffered flux that has a wide activation range and good wetting characteristics that produce bright shiny solder joints. WS770 performs well with bare copper, solder-coated, and organic coated PWBs.
NC Paste Flux
Features: - For use with Sn/Pb and Pb-Free alloys - Excellent Wetting - Wide Process Window - Used for Ball Attach
NC Paste Flux is a no clean tacky/rework flux designed to wet virtually all solderable electronic surfaces, components, assemblies, and substrates. AIM NC Paste Flux may be used for general touch up or rework of printed circuit boards, and for attaching spheres to ball grid array (BGA) packages.