PACE TF 1800 BGA/SMD System

The new PACE TF 1800 BGA/SMD System, for rework of BGA, QFN, CSP, CGA, PoP, Flip Chip, 0201 and other bottom terminated components. Today's extremely high thermal mass boards, ultra fine-pitch components and challenging production rework environments demand greater process control, thermal performance and faster throughput than ever before. PACE's new TF 1800 BGA/SMD Rework System easily outperforms competitive stations with a host of innovative features:

Revolutionary, patent-pending Inductive-Convection heater reaches target temperatures/cools in seconds
Automated reflow head offers ultra-precise 28µm (.0011") placement accuracy
Counterbalanced Vacuum Pick/Shaft with optical sensor eliminates placement pressure
HD Optical Alignment System with exclusive Quad Field Imaging for alignment of outsized BGAs/QFPs
Integrated underside Board Support Wand prevents warping during reflow
PACE-exclusive height-adjustable IR Preheater
Much, much more!