PACE TF 1800 BGA/SMD System

The new PACE TF 1800 BGA/SMD System, for rework of BGA, QFN, CSP, CGA, PoP, Flip Chip, 0201 and other bottom terminated components. Today's extremely high thermal mass boards, ultra fine-pitch components and challenging production rework environments demand greater process control, thermal performance and faster throughput than ever before. PACE's new TF 1800 BGA/SMD Rework System easily outperforms competitive stations with a host of innovative features:

  • Revolutionary, patent-pending Inductive-Convection heater reaches target temperatures/cools in seconds

  • Automated reflow head offers ultra-precise 28µm (.0011") placement accuracy

  • Counterbalanced Vacuum Pick/Shaft with optical sensor eliminates placement pressure

  • HD Optical Alignment System with exclusive Quad Field Imaging for alignment of outsized BGAs/QFPs

  • Integrated underside Board Support Wand prevents warping during reflow

  • PACE-exclusive height-adjustable IR Preheater

  • Much, much more!

Call or email today for more info!

sales@ce3s.com 800-955-0225

#PACE #BGA #Solder #PCB

Featured Posts
Recent Posts
Archive
Search By Tags
No tags yet.
Follow Us
  • Facebook Basic Square
  • Twitter Basic Square
  • Google+ Basic Square

© 2017 by CE3S 

© Copyright CE3S
  • Facebook Social Icon
  • Twitter Social Icon
  • Google+ Social Icon