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PACE TF 1800 BGA/SMD System

February 24, 2017

 

 

The new PACE TF 1800 BGA/SMD System, for rework of BGA, QFN, CSP, CGA, PoP, Flip Chip, 0201 and other bottom terminated components. Today's extremely high thermal mass boards, ultra fine-pitch components and challenging production rework environments demand greater process control, thermal performance and faster throughput than ever before. PACE's new TF 1800 BGA/SMD Rework System easily outperforms competitive stations with a host of innovative features:

  • Revolutionary, patent-pending Inductive-Convection heater reaches target temperatures/cools in seconds 

  • Automated reflow head offers ultra-precise 28µm (.0011") placement accuracy 

  • Counterbalanced Vacuum Pick/Shaft with optical sensor eliminates placement pressure 

  • HD Optical Alignment System with exclusive Quad Field Imaging for alignment of outsized BGAs/QFPs

  • Integrated underside Board Support Wand prevents warping during reflow 

  • PACE-exclusive height-adjustable IR Preheater 

  • Much, much more!

 

 

 

 

 

Call or email today for more info!

 

sales@ce3s.com  800-955-0225

 

 

 

 

 

 

 

 

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