Tue, Sep 10 | ACI Technologies, Inc

BGA/SMD Component Technical Workshop Philadelphia

Registration is Closed
BGA/SMD Component Technical Workshop Philadelphia

Time & Location

Sep 10, 2019, 9:00 AM – 12:00 PM
ACI Technologies, Inc, 1 International Plaza Dr #600, Philadelphia, PA 19113, USA

About the Event

We would like to invite you to join us at our Technical workshop in Philadelphia featuring the TF-1800 BGA and SMD rework system where we will be demonstrating some fundamentals of BGA/SMD component rework.

The TF -1800’s Patented Inductive-Convection Heater Provides Ultimate Thermal Performance.

Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN, CSP, CGA, PoP, Flip Chip, 0201 and other bottom terminated components. However, today’s extremely high thermal mass boards, ultra-fine pitch components and challenging production rework environments demand greater process control, thermal performance and faster throughput than ever before.

Enter PACE’s TF 1800 BGA/SMD Rework System. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF 1800’s top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually any component installation or removal application.

This will be a great opportunity to see the TF-1800 in action and meet with the PACE reps and CE3S team in an informal workshop. The best part is it’s FREE but registration is required.

We also welcome you to bring a sample board to see how the TF-1800 can help with your application.

Registration is Closed

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